Product Description
CU118SP Copper Powder, Fine, Spherical
CU118SP is a fine, high density, high purity spherical copper powder that provides high heat conductivity and electrical conductivity properties to your products.
Our specification guarantees that at least 80% of this powder are particles smaller than 44 micron. A typical analysis however shows that 88% of particles are smaller than 44 micron. Most particles are between 16 micron and 28 micron.
Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster,dry-wall, paint, adhesives and grout.
Also used in 3D printing process known as Selective Powder Deposition (SPD)
Our specification guarantees that at least 80% of this powder are particles smaller than 44 micron. A typical analysis however shows that 88% of particles are smaller than 44 micron. Most particles are between 16 micron and 28 micron.
Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster,dry-wall, paint, adhesives and grout.
Also used in 3D printing process known as Selective Powder Deposition (SPD)
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
Safety Data Sheet for Copper Powder
Key Features:
- High-purity, high-density spherical copper powder
- Provides high heat conductivity and electrical conductivity
- Suitable for various applications, including cold casting, 3-D printer filaments, metal clay, sintering, green/blue patina and rust effect, preventing mold in concrete, plaster, dry-wall, paint, adhesives, and grout
- Used in the 3D printing process known as Selective Powder Deposition (SPD)
- Particle size distribution with 88% of particles smaller than 44 micron
Product Specifications:
| Copper Purity | Over 99.5% |
| Hydrogen Loss | Less than 0.7% |
| Apparent Density | 4.5-5.5 g/cc |
| Typical Analysis | Copper > 99.5% Hydrogen Loss < 0.7% Apparent Density, g/cc: 4.5 - 5.5 Passing mesh 325 (44 micron): 80% ~ 88% |
Similar Products:
- Ultra-Fine Copper Powder
- High-Purity Copper Foil
- Copper Wire
- Copper Rod
- Copper Sheet
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for enhanced conductivity and versatility applications, including cold casting, 3-D printing, metal clay, and more.
