Copper Powder, Super Fine, Spherical

Copper Powder, Super Fine, Spherical

Copper Powder CU112SP is a super fine, high density, high purity spherical copper powder designed to provide high heat conductivity and electrical conductivity properties. Specification guarantees that at least 95% of particles are smaller than 44 micron (325 mesh), with typical analysis showing 99.9% passing 44 micron. Most particles range between 10 micron and 22 micron. Purity is greater than 99.2% copper, hydrogen loss is less than 0.7%, and apparent density ranges from 4.5 to 5.5 g/cc. HTS Code: 7406.10.0000. NMFC: 30743. CAS Number: 7440-50-8. Old product code: CU155A. Applications include cold casting, 3-D printer filaments, metal clay, sintering, green/blue patina and rust effect finishes, mold prevention in concrete, plaster, dry-wall, paint, adhesives, and grout. Also used in Selective Powder Deposition (SPD) 3D printing processes. Note: Pure copper powders may not show continuity or conductivity when tested with a multimeter due to low test voltage or weak interparticle contact. Conductivity improves with higher voltage, compaction, or when mixed with oil or resin to form a paste.

Product Specifications

Applications and Benefits:

• Cold casting and metal clay formulations
• 3-D printer filaments and Selective Powder Deposition (SPD)
• Sintering processes
• Green/blue patina and rust effect decorative finishes
• Anti-mold additive for concrete, plaster, and dry-wall
• Conductive filler in paint, adhesives, and grout

Caution:

Pure copper powders may not show conductivity when tested with a multimeter due to low test voltage or weak interparticle contact. Conductivity improves with higher voltage, compaction, or use in paste formulations. Refer to the Product Data Sheet (PDS) for complete handling and safety guidance.