Product Description
Copper Powder CU155A-CU112SP
Very high purity, air atomized, hydrogen reduced ultra fine copper powder. Spherical particle. High conductivity. High Density.
HTS Code: 7406.10.0000
NMFC: 30743
CAS: 7440-50-8
New product code is CU112SP
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
Safety Data Sheet for Copper Powder
Key Features
- 99.5% - 99.9% purity level
- Spherical particle shape
- High conductivity and density
- Suitable for various industrial applications
- Consistent sieve analysis
Product Specifications
| Copper Content | 99.81% |
| Iron Content | 0.01% |
| Hydrogen Loss | 0.18% |
| Apparent Density | 4.89 g/cc |
| Typical Analysis | Copper: 99.81% Iron: 0.01% Hydrogen Loss: 0.18% Apparent Density: 4.89 g/cc SIEVE ANALYSIS +200 MESH: 0% -200+325 MESH: 4.8% -325 MESH: 95.2% |
Similar Products
- Fine spherical aluminum powder, high purity
- Ultra fine nickel powder, spherical, conductive
- Atomized bronze powder, high density, fine particle
- Spherical zinc powder, high conductivity, ultra fine
- Fine silver powder, high purity, conductive particles
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for Electronics Manufacturers, Industrial Chemists, Thermal Management Engineers, Brazing Professionals, Research and Development Teams
Recommended for:
- Thick and Thin Film pastes
- Capacitor Chips
- End cap Terminators
- Conductive Inks, paints and pastes
- Injection Molding
- Electronics
- Thermal management
- EDM Electrodes
- Thermal Sprays
- Sintered alloys/ products
- Brazing/ soldering paste
