Product Description
Electronic grade Copper powder, high purity, water attomized, hydrogen reduced ultra fine copper powder with spheroidal particles. Higher conductivity. Lower Density.
May be used for metal injection molding as well as other applications were the conductivity of product is important.
HTS Code: 7406.10.0000
NMFC: 30743
CAS: 7440-50-8
Additional Description
Recommended for:
- Thick and Thin Film pastes
- Capacitor Chips
- End cap Terminators
- Conductive Inks, paints and pastes
- Injection Molding
- Electronics
- Thermal management
- EDM Electrodes
- Thermal Sprays
- Sintered alloys/ products
- Brazing/ soldering paste
Typical Analysis:
Copper: 99.85%
Hydrogen Loss: 0.19%
Apparent Density: 2.97 g/cc
SIEVE ANALYSIS
+60 MESH: 0%
-60/+80 MESH: 0%
-80/+100 MESH: 0%
-100/+140 MESH: TR
-140/+200 MESH: TR
-200/+325 MESH: 0.6%
-325 MESH: 99.4%
Note: Pure copper powders do not show continuity or conductivity by a multimeter. I think there are two reasons for that. One is the low voltage used for the test. The other is lots of air and weak contacts between the particles. They will show conductivity with higher voltage, when they are compacted and when they are mixed with some oil or resin to form a paste.
